Shinko Electric Industries Co., Ltd., commonly known as Shinko, is a leading company in the semiconductor industry, renowned for its innovative technologies and high-quality products. Established in 1946, Shinko has consistently contributed to the advancement of semiconductor packaging and interconnect solutions. The company specializes in manufacturing substrates, leadframes, and various other components essential for semiconductor devices. Shinko’s products play a crucial role in ensuring the performance and reliability of electronic devices, making them a key player in the global semiconductor supply chain.

The purpose of this blog post is to provide a comprehensive introduction to Shinko substrates and related technologies and products. We will explore the core concepts of Shinko substrates, their applications, and the differences between substrates and leadframes. Additionally, we will delve into advanced products such as coreless substrates and integrated thermal management solutions, highlighting Shinko’s contributions to the semiconductor industry’s evolution.

In today’s digital age, Graphics Processing Units (GPUs) play a pivotal role in enhancing the performance and capabilities of modern computing systems and mobile devices. These specialized processors excel in parallel computing tasks, crucial for graphics rendering, scientific simulations, and artificial intelligence applications. Alongside GPUs, substrates serve as fundamental components in electronic devices, providing structural support and facilitating electrical connections between components. The choice and quality of substrates directly impact the efficiency, reliability, and thermal management of electronic systems. Understanding the synergy between GPUs and substrates is essential for appreciating their combined role in advancing technological innovation and meeting the increasing demands for computational power and efficiency in diverse industries.

Semiconductor packaging plays a pivotal role in protecting and connecting delicate semiconductor devices, ensuring their functionality and reliability in various applications. Central to this process are substrates, which provide structural support and electrical pathways. Among these substrates, materials such as glass have gained prominence due to their unique properties like thermal stability and electrical insulation. In the semiconductor industry, where miniaturization and performance enhancements are constant goals, glass substrates offer crucial advantages. They enable advanced technologies such as Through Glass Vias (TGVs) and facilitate the integration of multiple components in compact designs. Understanding the role and benefits of glass substrates in semiconductor packaging is essential for appreciating their growing significance in modern electronic devices.

In the realm of modern electronics, silicon chips serve as the bedrock of computational power and functionality, underpinning everything from smartphones to supercomputers. However, alongside the evolution of silicon technology, the materials on which these chips are built play a pivotal role. Glass substrates, in particular, have emerged as crucial components in advancing semiconductor technologies. Their ability to provide a stable and reliable foundation for intricate circuitry has contributed significantly to the miniaturization, efficiency, and durability of electronic devices. As Intel continues to innovate in this domain, exploring the capabilities of glass core substrates promises further breakthroughs in enhancing performance and functionality across a wide array of electronic applications.

FR4 substrate is a type of flame-retardant fiberglass composite material used widely in printed circuit boards (PCBs). It consists of layers of woven fiberglass cloth impregnated with epoxy resin, which is then cured under high temperature and pressure to form a rigid laminate.

Commonly recognized for its electrical insulation properties and mechanical strength, FR4 is ideal for applications requiring reliable performance in electronics. It offers excellent dimensional stability, resistance to moisture and chemicals, and can withstand high temperatures, making it suitable for various environments.

Due to its versatility, FR4 is extensively used in consumer electronics, telecommunications, automotive electronics, aerospace, and industrial equipment. Its ability to provide a stable platform for mounting electronic components while ensuring electrical integrity has solidified its status as the industry standard substrate for PCB manufacturing.