Low Temperature Co-Fired Ceramic (LTCC) technology is a advanced method for creating high-performance electronic substrates by co-firing ceramic and metal layers at relatively low temperatures. This technology is notable for its ability to integrate multiple layers of electronic circuits into a compact and reliable substrate, making it essential for modern electronics.
LTCC technology is significant due to its versatility and high performance. It supports the integration of complex circuitry and components, enabling miniaturization and high-density packaging. This is particularly valuable in applications requiring high-frequency and high-speed signal processing, such as in wireless communication, automotive electronics, and consumer devices. By offering excellent thermal and electrical properties, LTCC substrates enhance the reliability and efficiency of electronic devices, contributing to advancements in technology and performance across various industries.
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