BT Substrates
High-performance materials with excellent thermal stability and reliability for advanced semiconductor packaging applications.
ABF Substrates
Advanced substrate solutions designed for high-density interconnect and next-generation packaging requirements.
Glass Substrates
Advanced substrate solutions with excellent dimensional stability for next-generation semiconductor packaging.
Ceramic & Custom Materials
Specialized material platforms for thermal management, power electronics and customized applications.
Multi-Material Substrates for Advanced Electronic Applications
Modern electronic systems require substrate solutions with different electrical, thermal and mechanical characteristics.
ALCANTA supports multiple material platforms to help customers select the optimal substrate solution based on application requirements, performance targets and manufacturing needs.
✓ Multiple material platforms
✓ Customized stack-up design
✓ Application-driven solutions
✓ Engineering support
Multi-Material Substrate Material Solutions
Thermal Reliability & Packaging Performance
BT materials provide excellent thermal stability, mechanical strength and electrical reliability, making them suitable for advanced semiconductor packaging applications.
Typical Applications:
• IC Packaging
• Semiconductor Modules
• High-density Electronic Systems
Multi-Material Manufacturing Capability
| Item | Capability |
|---|---|
| Item Capability | BT / ABF / PI / Ceramic / Metal-based / FR-4 |
| Line / Space | 9μm / 9μm |
| Minimum Via Diameter | 55μm |
| Layer Structure | Customized |
| Board Thickness | Customized |
| Board Size | Customized |
| Material Combination | Application-based |
| Surface Finish | Customized |
| Quality Control | Electrical & Reliability Testing |
From Material Selection to Production
Engineering Review
生产前评估材料兼容性、
设计要求和制造补充。
Prototype Validation
支持定制基板解决方案的原型开发和
性能验证。
Volume Production
提供稳定的生产能力
，并具备持续的质量控制和
生产支持。
Frequently Asked Questions About Multi-Material Substrates
What are Multi-Material Substrates?
Multi-Material Substrates are substrate solutions that combine different material platforms to meet specific electrical, thermal and mechanical requirements.
ALCANTA supports various materials including BT, ABF, PI, ceramic and metal-based substrates for advanced electronic applications.
What materials can be used in Multi-Material Substrates?
Multi-Material Substrates can incorporate different material platforms such as BT, ABF, PI, ceramic and metal-based materials.
Material selection depends on application requirements including thermal performance, electrical characteristics and structural needs.
What applications use Multi-Material Substrates?
Multi-Material Substrates are commonly used in semiconductor packaging, AI computing systems, automotive electronics, power electronics and industrial applications.
Can ALCANTA provide customized substrate solutions?
Yes. ALCANTA provides customized substrate solutions based on customer requirements, including material selection, stack-up design, thickness and structural configurations.
What manufacturing capabilities does ALCANTA support?
ALCANTA supports advanced substrate manufacturing capabilities including fine-line structures, customized layer configurations, prototype validation and volume production support.
