In the realm of semiconductor packaging, the package substrate serves as a fundamental component, providing structural support and electrical connectivity for integrated circuits (ICs). Essentially, a package substrate acts as a platform upon which semiconductor chips are mounted and interconnected. Its significance lies in facilitating efficient signal transmission, thermal management, and overall reliability of electronic devices. 

Among various substrate configurations, the 4-layer package substrate stands out for its balanced performance and versatility. This substrate architecture comprises multiple layers of materials meticulously designed to meet the demands of modern semiconductor packaging, offering enhanced electrical performance, thermal dissipation, and miniaturization capabilities. In this blog, we delve into the intricacies of 4-layer package substrates, exploring their composition, functionalities, and applications in the semiconductor industry.

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