Top HDI PCB Manufacturer: High-Performance PCB Solutions

High-Density Interconnect (HDI) PCBs are advanced circuit boards that feature finer lines, smaller vias, and higher wiring density, enabling more complex and compact designs. As a critical component in modern electronics, HDI PCBs enhance signal integrity and reduce electromagnetic interference, making them ideal for high-performance applications such as smartphones, automotive systems, and medical devices. Compared to traditional PCBs, HDI PCBs employ microvias, blind and buried vias, and laser drilling technology, which significantly increases layer density and aspect ratio capabilities. While standard PCBs rely on through-hole vias and thicker traces, HDI PCBs achieve superior electrical performance through reduced signal loss and improved impedance control. As demand for miniaturization and high-speed applications continues to grow, selecting the right hdi pcb manufacturer becomes essential for ensuring quality and reliability in advanced electronics.

Table of Contents

Overview of HDI PCB Manufacturing by Leading HDI PCB Manufacturer

HDI PCB Fabrication Process

The manufacturing process employed by a reliable hdi pcb manufacturer involves multiple advanced stages to ensure high precision and performance. Below are the key steps involved in HDI PCB fabrication:

Microvia Drilling (Laser Drilling):
Microvias are the defining feature of HDI PCBs, enabling connections between multiple layers through extremely small holes. Laser drilling technology, typically UV or CO2 lasers, is used by an hdi pcb manufacturer to create precise microvias with diameters as small as 50–75 microns, ensuring minimal thermal impact and high aspect ratio.
Sequential Lamination and Stacking:
Sequential build-up (SBU) is a critical process in HDI PCB manufacturing, where multiple layers are laminated and bonded together using resin-coated copper foil (RCC) or prepreg materials. A trusted hdi pcb manufacturer employs high-pressure, high-temperature lamination techniques to maintain layer alignment and ensure robust mechanical integrity.
Advanced Surface Finishes (ENIG, OSP, HASL):
Surface finishes protect the copper circuitry and enhance solderability. High-quality hdi pcb manufacturers offer various surface finish options, including Electroless Nickel Immersion Gold (ENIG) for excellent corrosion resistance, Organic Solderability Preservative (OSP) for cost-effective surface protection, and Hot Air Solder Leveling (HASL) for thicker and durable solder joints.

Key Technologies in HDI PCB Manufacturing

To ensure the highest quality, an experienced hdi pcb manufacturer utilizes state-of-the-art technologies during HDI PCB production. These technologies include:

Microvia, Blind and Buried Vias:
Microvias, which are significantly smaller than traditional vias, connect adjacent layers and improve signal performance. Blind vias link outer layers to inner layers, while buried vias connect inner layers without extending to the outer layers, allowing for higher wiring density.
Laser Drilling and Via-in-Pad Techniques:
Laser drilling technology enables the creation of precise microvias, improving connectivity and reducing signal distortion. Via-in-pad technology, often adopted by an hdi pcb manufacturer, enhances heat dissipation and reduces parasitic inductance, improving the overall performance of the PCB.
High Aspect Ratio and Thin Dielectric Materials:
HDI PCBs require a high aspect ratio (ratio of hole depth to hole diameter) to maintain electrical integrity. Leading hdi pcb manufacturers use advanced dielectric materials with low Dk (dielectric constant) to ensure minimal signal loss and optimal high-frequency performance.

A reliable hdi pcb manufacturer integrates these technologies with strict quality control processes to meet the demanding requirements of advanced electronic applications.

Top HDI PCB Manufacturers in China: Leading HDI PCB Manufacturer Options

China is home to some of the world’s most advanced hdi pcb manufacturer facilities, offering cutting-edge technologies and high-quality fabrication services. Below are four prominent hdi pcb manufacturer options in China, known for their expertise in HDI PCB production and reliable delivery for global clients.

RayMing PCB & Assembly

RayMing PCB & Assembly is a leading hdi pcb manufacturer in China, specializing in complex multilayer HDI designs that support the most demanding electronic applications.

Specialization in HDI PCB and Complex Multilayer Designs:
RayMing focuses on producing high-layer count HDI PCBs with advanced microvia and via-in-pad technologies. Their expertise extends to hybrid HDI structures, including sequential lamination and multiple buildup layers to achieve high density and enhanced performance.
Manufacturing Capabilities and Certifications:
RayMing utilizes state-of-the-art laser drilling, sequential lamination, and high-precision etching technologies to manufacture HDI PCBs with superior quality. The company holds ISO 9001, UL, and IPC certifications, ensuring compliance with global industry standards.
Key Applications:
As a trusted hdi pcb manufacturer, RayMing serves industries such as IoT devices, smartphones, automotive systems, and medical electronics, where high reliability and compact designs are essential.

Hemeixin PCB

Hemeixin PCB is renowned for its expertise in HDI rigid-flex PCB fabrication and high-precision microvia drilling technology.

Expertise in HDI Rigid-Flex PCB Fabrication:
Hemeixin excels in fabricating rigid-flex HDI PCBs with intricate designs that combine flexible and rigid sections. Their ability to integrate high-density circuitry into compact designs makes them a preferred hdi pcb manufacturer for complex applications.
Capabilities in Microvia Drilling and Sequential Build-Up (SBU):
Hemeixin employs laser microvia drilling, via-in-pad techniques, and advanced SBU processes to produce HDI PCBs with high aspect ratios and superior electrical performance. Their sequential lamination expertise ensures precise layer stacking and alignment.
Cost Estimation and Fabrication Options:
Hemeixin offers flexible pricing models for prototyping and mass production, allowing customers to choose the best option based on project requirements. Their online cost calculator provides instant cost estimation, making them a transparent hdi pcb manufacturer for budget-conscious clients.

Viasion PCB

Viasion PCB is a reputable hdi pcb manufacturer specializing in low-to-medium volume HDI PCB production, with a strong focus on reliability and quality control.

Low-to-Medium Volume HDI PCB Manufacturing:
Viasion caters to customers who require small-to-medium batch production of HDI PCBs. Their production facilities ensure consistent quality, even in lower volume orders, making them ideal for prototyping and pilot production.
Focus on Reliability and Quality Control Standards:
Viasion follows rigorous quality control processes, including automated optical inspection (AOI), X-ray analysis, and impedance testing. Their compliance with ISO 9001 and IPC-A-600 ensures the highest standards in HDI PCB fabrication, reinforcing their status as a dependable hdi pcb manufacturer.

MadPCB

MadPCB specializes in prototyping and low-volume production of high-layer count HDI PCBs with a focus on complex designs.

Prototyping and Low-Volume Production of HDI PCBs:
MadPCB is a preferred hdi pcb manufacturer for companies that require rapid prototyping and low-volume production of complex HDI PCBs. Their quick turnaround times and flexible manufacturing options ensure timely delivery of prototypes and small batches.
Strength in Multilayer and Complex Designs:
MadPCB excels in fabricating multilayer HDI PCBs that require advanced features such as blind and buried vias, via-in-pad, and sequential lamination. Their ability to handle complex designs with precision makes them a reliable choice for applications in telecommunications, aerospace, and medical industries.

Each hdi pcb manufacturer listed here brings unique strengths to the market, ensuring that customers can select the best fit for their project’s complexity, volume, and quality requirements.

Prominent HDI PCB Manufacturers in India: Key HDI PCB Manufacturer Options

India has emerged as a growing hub for HDI PCB production, with several leading hdi pcb manufacturer companies offering high-quality solutions that cater to the rapidly expanding electronics industry. Below are three prominent hdi pcb manufacturer options in India, known for their expertise in HDI PCB manufacturing, competitive pricing, and industry-specific solutions.

RayPCB India Division

RayPCB India Division is a well-established hdi pcb manufacturer that caters to the unique demands of the Indian market while maintaining globally recognized quality standards.

Focus on Indian Market Needs and Competitive Pricing:
RayPCB India Division has a deep understanding of the Indian electronics market and offers cost-effective solutions tailored to the requirements of local manufacturers. Their competitive pricing makes them a preferred hdi pcb manufacturer for small and medium enterprises (SMEs) as well as large-scale industrial applications.
Specialization in Advanced HDI PCB Production:
RayPCB India Division excels in producing high-density, multilayer HDI PCBs with microvias, blind and buried vias, and via-in-pad designs. Their ability to implement sequential lamination, laser drilling, and advanced surface finishes ensures high-reliability PCBs for demanding applications. As a reliable hdi pcb manufacturer, RayPCB India provides tailored HDI solutions that support high-frequency, high-speed devices in various industries.

TTM Technologies India

TTM Technologies India is a leading hdi pcb manufacturer with a reputation for delivering high-end HDI PCB solutions for specialized applications.

Leading Manufacturer of High-End HDI PCBs:
TTM Technologies India specializes in manufacturing high-layer count HDI PCBs for applications that require superior signal integrity, high-speed data transmission, and miniaturization. Their advanced fabrication technologies include microvia drilling, sequential build-up (SBU), and via-in-pad techniques, ensuring high-density designs with exceptional performance.
Emphasis on Telecommunications, Automotive, and Aerospace Sectors:
As an experienced hdi pcb manufacturer, TTM Technologies India focuses on serving high-reliability sectors such as telecommunications, automotive electronics, and aerospace applications. Their ability to meet the stringent requirements of these industries ensures consistent quality and durability in harsh operating environments. TTM’s commitment to excellence positions them as a trusted hdi pcb manufacturer for complex and mission-critical projects.

PCB Power Market

PCB Power Market is a trusted hdi pcb manufacturer in India that specializes in prototyping and low-volume production of complex HDI PCBs.

Strong Presence in Prototyping and Low-Volume HDI PCB Manufacturing:
PCB Power Market is known for its strong foothold in the prototyping and low-volume manufacturing segment. Their ability to quickly turn around HDI PCB prototypes enables engineers and designers to validate complex designs efficiently. As a leading hdi pcb manufacturer, they offer flexible options for small batch production while maintaining strict quality standards.
Experience with Complex Circuit Designs:
PCB Power Market has extensive experience in fabricating HDI PCBs with intricate circuit layouts that require advanced microvia technology, high aspect ratios, and multiple lamination cycles. Their expertise makes them a preferred hdi pcb manufacturer for applications in industrial automation, medical devices, and consumer electronics where complex designs are essential.

Why Choose an HDI PCB Manufacturer in India?

India’s hdi pcb manufacturer industry is growing rapidly, driven by increasing demand for high-performance electronics in telecommunications, automotive, and IoT sectors. Manufacturers such as RayPCB India, TTM Technologies India, and PCB Power Market provide high-quality HDI PCBs with competitive pricing, making them ideal partners for both local and international clients.

Key Factors to Consider When Choosing an HDI PCB Manufacturer

Selecting the right hdi pcb manufacturer is critical for ensuring that your high-density interconnect (HDI) PCB meets the required performance, quality, and cost expectations. Whether for prototyping, mass production, or specialized applications, an ideal hdi pcb manufacturer should meet stringent standards in terms of certifications, manufacturing capabilities, turnaround time, and cost estimation. Below are the key factors to evaluate before choosing an hdi pcb manufacturer.

Certifications and Compliance

A reputable hdi pcb manufacturer should hold industry-standard certifications that ensure product quality, safety, and compliance with international regulations.

ISO Certifications:
ISO 9001 certification ensures that the hdi pcb manufacturer adheres to a quality management system (QMS) that meets global standards for consistency and reliability. ISO 14001 certification reflects the company’s commitment to environmentally sustainable manufacturing practices.
IPC Standards:
Compliance with IPC-6012 and IPC-A-600 standards guarantees that the hdi pcb manufacturer meets the industry’s strict guidelines for high-quality printed circuit boards, including minimum requirements for microvia reliability, lamination integrity, and surface finish quality.
UL Certification:
Underwriters Laboratories (UL) certification ensures that the hdi pcb manufacturer adheres to electrical safety and fire hazard standards. UL-listed PCBs provide assurance that the materials and processes used meet safety regulations, which is especially crucial for automotive, aerospace, and medical applications.
Traceability and Quality Management System (QMS):
An ideal hdi pcb manufacturer should implement a comprehensive traceability system that tracks every stage of the production process, enabling full accountability for material sourcing, process parameters, and final inspection.

Manufacturing Capabilities

Advanced manufacturing capabilities are essential for ensuring that the hdi pcb manufacturer can produce complex, high-layer count PCBs with superior accuracy and reliability.

Microvia Drilling and Lamination Technology:
Leading hdi pcb manufacturers utilize high-precision laser drilling technology to create microvias, blind vias, and buried vias with diameters as small as 50 microns. Sequential build-up (SBU) and resin-coated copper foil (RCC) lamination ensure precise layer alignment and strong interconnects between stacked layers.
Maximum Layer Count and Aspect Ratio Handling:
A qualified hdi pcb manufacturer should have the ability to handle high-layer count PCBs (typically up to 16 layers or more) with aspect ratios exceeding 10:1. High aspect ratio capabilities ensure strong structural integrity and enhanced signal performance in high-frequency applications.

Turnaround Time and Lead Time

Fast and reliable delivery is a critical factor when selecting an hdi pcb manufacturer, especially when working with tight project deadlines.

Prototyping and Mass Production:
A reliable hdi pcb manufacturer should offer quick turnaround times for prototypes, typically within 5–7 days, while maintaining strict quality standards. For mass production, lead times can vary depending on the layer count, complexity, and order volume.
Delivery Schedules and Flexibility:
Leading hdi pcb manufacturers provide flexible delivery schedules and the ability to adjust production timelines based on customer requirements. They should also offer expedited production options for urgent projects without compromising quality.

Pricing and Cost Estimation

Understanding the cost structure is essential when choosing an hdi pcb manufacturer to ensure that the project remains within budget without sacrificing quality.

Material Selection and Layer Complexity:
The type of materials used (FR4, Rogers, or other high-frequency laminates) directly impacts the cost. Additionally, the number of layers, microvia density, and aspect ratio influence the overall price. A reliable hdi pcb manufacturer will provide detailed material specifications and transparent pricing structures.
Microvia and Via Technologies:
Advanced via technologies, such as via-in-pad and stacked microvias, require more sophisticated fabrication processes, increasing the overall cost. The number of drill cycles and the complexity of sequential lamination processes also contribute to the pricing structure offered by the hdi pcb manufacturer.
Cost Estimation Tools and Transparency:
Many reputable hdi pcb manufacturers offer online cost estimation tools that allow customers to input design parameters and receive real-time cost estimates. This transparency helps clients evaluate the trade-offs between different design choices and budget constraints.

Conclusion: Choosing the Right HDI PCB Manufacturer

When selecting an hdi pcb manufacturer, it is essential to assess their certifications, manufacturing capabilities, lead times, and cost estimation models. A reliable hdi pcb manufacturer will not only meet industry standards but also ensure consistent quality, timely delivery, and cost-effective solutions for high-performance applications.

HDI PCB Cost Analysis and Estimation: Insights from Leading HDI PCB Manufacturer

Understanding the cost structure of HDI PCBs is essential for making informed decisions when selecting an hdi pcb manufacturer. The cost of manufacturing HDI PCBs depends on various factors, including material selection, fabrication complexity, and testing requirements. Below is a detailed breakdown of the cost components and how a trusted hdi pcb manufacturer can help manage these costs effectively.

Cost Breakdown of HDI PCBs

An experienced hdi pcb manufacturer calculates the total cost of HDI PCB production by considering the following factors:

Materials: FR4 and High-Frequency Laminates

FR4 Material:
FR4 is the most commonly used material in HDI PCB fabrication due to its cost-effectiveness and thermal stability. It is ideal for standard HDI applications where high-frequency performance is not a critical requirement.
High-Frequency Laminates:
For applications that demand high-frequency performance, such as RF and microwave devices, high-frequency laminates such as Rogers, Isola, and Taconic materials are preferred. These laminates increase the overall cost, but they provide superior dielectric properties and minimal signal loss.
Resin-Coated Copper Foil (RCC):
RCC is often used in HDI designs to facilitate sequential lamination and ensure strong layer bonding, contributing to higher material costs.

Fabrication Processes: Via-in-Pad and Microvias

Via-in-Pad Technology:
Via-in-pad technology, where vias are directly placed within the pad, enhances signal integrity and thermal management. However, this process involves additional plating and filling steps, making it more expensive.
Microvias, Blind, and Buried Vias:
Microvias, blind vias, and buried vias significantly increase fabrication complexity. Multiple drill cycles and laser drilling techniques used by an hdi pcb manufacturer for high-density interconnects raise production costs, especially for high-layer count designs.
Sequential Lamination and Stacking:
Sequential build-up (SBU) technology, used to fabricate complex HDI PCBs with multiple layers, adds to the overall cost due to the need for multiple lamination cycles and precise layer alignment.

Assembly and Testing

Component Assembly:
Surface-mount technology (SMT) and through-hole assembly processes contribute to the final cost. High-precision assembly is required for HDI PCBs with fine-pitch components and microvias.
Testing and Quality Assurance:
Rigorous testing procedures, including automated optical inspection (AOI), X-ray inspection for microvias, and impedance testing, ensure that the HDI PCB meets performance specifications. These quality assurance measures increase production costs but guarantee reliability and durability.

HDI PCB Cost Calculator: Estimating Costs with Precision

To assist customers in evaluating the cost of their projects, a leading hdi pcb manufacturer such as Hemeixin PCB provides an HDI PCB cost estimation tool. This tool helps customers estimate costs based on design parameters and material choices.

Insights from Hemeixin PCB’s Cost Estimation Tool

Hemeixin PCB’s cost calculator allows users to input critical design parameters, including:

Number of layers and layer stack-up configuration
Type of materials used (FR4, high-frequency laminates)
Via technology (microvias, blind/buried vias, via-in-pad)
Surface finish options (ENIG, OSP, HASL)

Based on these inputs, the cost calculator provides an accurate estimate of production costs, helping customers choose the most cost-effective design without compromising quality.

Cost Factors for Rigid-Flex and High-Layer Count PCBs

Rigid-Flex HDI PCBs:
Rigid-flex HDI PCBs require specialized fabrication processes that combine flexible and rigid sections, increasing the overall cost. The complexity of laminating flexible substrates with rigid materials makes this type of PCB more expensive than standard rigid HDI PCBs.
High-Layer Count PCBs:
As the layer count increases, the cost rises due to additional lamination cycles, increased drilling time, and more stringent alignment tolerances. HDI designs with 10+ layers often require multiple sequential build-up (SBU) processes, making them more costly to fabricate.

Factors to Optimize HDI PCB Costs with an Experienced HDI PCB Manufacturer

A knowledgeable hdi pcb manufacturer can help reduce overall costs by optimizing design complexity, selecting cost-effective materials, and leveraging advanced fabrication technologies. Design adjustments, such as minimizing the number of vias and optimizing layer count, can lead to significant cost savings without compromising functionality.

Conclusion: Managing HDI PCB Costs Effectively

Choosing an experienced HDI PCB manufacturer with transparent cost estimation and advanced fabrication capabilities is key to managing production costs. Understanding material choices, complexity, and testing helps customers balance quality, performance, and budget.

Latest Trends and Future Prospects of HDI PCB Manufacturing: Insights from Leading HDI PCB Manufacturer

The demand for High-Density Interconnect (HDI) PCBs continues to grow, driven by technological advancements in miniaturization, high-speed communication, and IoT applications. Leading hdi pcb manufacturer companies are investing in innovative processes to meet the evolving needs of these industries. Below are the latest trends and future prospects shaping the HDI PCB manufacturing landscape.

Miniaturization and IoT Device Growth

As electronic devices become smaller and more powerful, the need for compact and high-performance PCBs has increased dramatically. An experienced hdi pcb manufacturer plays a crucial role in enabling miniaturization through advanced microvia and via-in-pad technologies.

Shrinking Component Sizes:
The growing adoption of wearable devices, IoT sensors, and medical implants demands extremely small PCBs with high component density. HDI PCBs allow for tighter spacing, reduced trace widths, and finer pitches, which are essential for these compact devices.
Increased Layer Count for Miniaturization:
To support high functionality in a smaller form factor, an hdi pcb manufacturer uses sequential build-up (SBU) technology to fabricate HDI PCBs with multiple stacked layers. This approach maximizes routing density while maintaining electrical performance in miniaturized devices.
Impact on IoT Market:
IoT devices rely on HDI PCBs for their lightweight, high-speed, and power-efficient designs. As the IoT ecosystem expands across industries such as smart homes, healthcare, and industrial automation, hdi pcb manufacturers are expected to play a pivotal role in meeting the demands of this growing market.

Increased Demand for 5G and High-Speed Applications

The rapid deployment of 5G and high-speed data applications has increased the demand for HDI PCBs with superior signal integrity and low latency. An innovative hdi pcb manufacturer addresses these challenges with advanced materials and high-frequency designs.

High-Frequency Signal Integrity:
5G networks operate at higher frequencies (up to 28 GHz and beyond), requiring HDI PCBs that maintain excellent signal integrity. To meet this demand, leading hdi pcb manufacturers use low-loss dielectric materials such as Rogers, Isola, and Taconic laminates, ensuring minimal signal distortion at high frequencies.
Ultra-Low Insertion Loss and Crosstalk:
HDI PCBs for 5G and high-speed applications must exhibit low insertion loss and minimal crosstalk between traces. Hdi pcb manufacturers utilize advanced via technologies, such as stacked microvias and via-in-pad designs, to minimize signal degradation and improve overall performance.
Application in 5G Infrastructure and Consumer Electronics:
As 5G technology expands, applications in mobile devices, data centers, and automotive communication systems will drive the demand for high-performance HDI PCBs. An experienced hdi pcb manufacturer ensures that these applications benefit from superior electrical performance and mechanical stability.

Advancements in Laser Drilling and SBU Processes

To meet the growing complexity of HDI designs, HDI PCB manufacturers are adopting advanced laser drilling and refining SBU processes for better precision and efficiency.

High-Precision Laser Drilling Techniques:
Laser drilling technology plays a critical role in creating microvias with diameters as small as 50–75 microns. Modern hdi pcb manufacturers leverage UV and CO2 lasers to achieve superior drilling accuracy and ensure consistent hole quality across multiple layers.
Via-in-Pad and Copper Filling Innovations:
Via-in-pad designs, which facilitate thermal management and improve electrical performance, have become a standard feature in high-end HDI PCBs. Leading hdi pcb manufacturers incorporate advanced copper filling techniques to strengthen via connections and minimize signal reflection.
Refined Sequential Build-Up (SBU) Processes:
SBU technology is essential for fabricating high-layer count HDI PCBs. By refining the SBU process, hdi pcb manufacturers improve layer alignment, minimize registration errors, and ensure consistent dielectric thickness across the board.

Future Prospects of HDI PCB Manufacturing

The future of HDI PCB manufacturing is promising, as emerging technologies drive the demand for high-performance, compact devices. A reliable hdi pcb manufacturer will be crucial in meeting the stringent requirements of next-generation applications.

Integration of Artificial Intelligence (AI) in Manufacturing:
AI-powered inspection and process control systems will allow hdi pcb manufacturers to identify defects and optimize production processes, resulting in improved yield rates and reduced costs.
Adoption of Flexible HDI PCBs:
Flexible HDI PCBs, which combine the benefits of rigid-flex and HDI technology, will gain traction in wearable electronics, medical implants, and automotive applications. Experienced hdi pcb manufacturers are already investing in flexible substrate technologies to meet this growing demand.
Expansion of HDI Applications in Aerospace and Defense:
As the aerospace and defense sectors adopt miniaturized and high-reliability electronic systems, hdi pcb manufacturers will play a vital role in supplying high-precision HDI PCBs that meet stringent performance and durability standards.

Conclusion: Embracing Innovation in HDI PCB Manufacturing

The continuous evolution of technology and increasing demand for high-speed, compact devices will drive innovation in HDI PCB production. By leveraging advancements in laser drilling, SBU processes, and high-frequency materials, a reliable hdi pcb manufacturer ensures that future applications benefit from enhanced performance, reliability, and efficiency.

FQAs Abut HDI PCB Manufacturer

Who is the manufacturer of HDI PCB in China?

There are several notable HDI PCB manufacturers in China, including Rayming PCB, Hemeixin PCB, Viasion PCB, MadPCB, and others. These companies specialize in high-density interconnect (HDI) PCB fabrication for various industries, including IoT, medical devices, telecommunications, and consumer electronics.

What is the difference between PCB and HDI PCB?

The primary difference between a standard PCB (Printed Circuit Board) and an HDI PCB (High-Density Interconnect PCB) lies in the complexity and density of interconnections. HDI PCBs have a higher layer count, smaller vias, and microvias, enabling greater component density and better signal integrity. HDI PCBs also use advanced techniques like via-in-pad and sequential lamination, which are not common in traditional PCBs. This makes HDI PCBs suitable for high-performance and compact devices like smartphones, wearables, and medical equipment.

Who is the manufacturer of HDI PCB in India?

Some prominent HDI PCB manufacturers in India include RayPCB’s India division, TTM Technologies India, and PCB Power Market. These companies provide HDI PCB solutions with specialization in areas like telecommunications, automotive, aerospace, and complex circuit designs.

How much does HDI PCB cost?

The cost of HDI PCBs varies depending on factors like material selection, layer count, via technology, and production volume. On average, HDI PCBs can cost more than traditional PCBs due to the additional complexity of microvias, stacked vias, and sequential lamination processes. For a rough estimate, the cost can range from a few dollars to tens of dollars per board depending on the specifications. A cost estimation tool from manufacturers like Hemeixin PCB can help provide a more accurate calculation based on project details.