Welcome To ALCANTA

ALCANTA has over 20 years of R&D experience and has been focusing on semiconductor packaging substrates since 2006, dedicated to technological innovation and breakthroughs. The company boasts a team of industry-leading experts in R&D, utilizing advanced MSAP and SAP technologies to precisely manufacture 4 to 16-layer FCBGA substrates with line widths and spacings as fine as 9μm. With outstanding technical expertise and stringent quality control, ALCANTA meets the demands of complex applications, consistently ensuring superior quality.

PCB Equipment-alcanta
ALCANTA-About1

Substrate Material

We offer a wide range of high-performance substrate materials, including PTFE, LCP, ceramic, polyimide, Teflon, high-frequency FR-4, ABF, beryllium oxide, HDI, silicon, copper, and aluminum. Additionally, we specialize in advanced packaging substrates such as FCBGA, SIP, and FCCSP, catering to various high-tech applications.

Our Mission and Vision

We are committed to providing high-quality PCB and semiconductor substrate manufacturing and assembly services that exceed our customers’ expectations at competitive prices. We focus on integrity, innovation and customer satisfaction to become a global leader in our industry. Driven by professionalism and expertise, our team is committed to fostering the growth and success of our customers, partners and employees, ensuring long-term, reliable and profitable relationships.

Total Quality Certification System

Our factory has implemented lean improvements in areas like DFM, NPI, IQC, IPQC, and OQA. These efforts have helped us achieve certifications including ISO 9001:2015, ISO 13485, IATF 16949, and SGS. Our dedication to quality and service has built long-term relationships with medium and large customers.

ALCANTA quality certification system

One-stop solution for PCB and substrate