• Professional FC-BGA Packaging Substrate and QFN Leadframe Supplier

    Package Substrate: 2 to 26 layers
    Microtrace/Gap: 9um/9um
    The minimum via size: 55um
    Materials: Glass, ABF, BT, Metal, Rogers,

    PCB Manufacturing

Experienced Package Substrate, QFN Leadframe, HDI PCB Manufacturing

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ALCANTA PCB specializes in manufacturing various types of packaging substrates, ranging from 2 layers to 26 layers. We support a minimum trace/spacing of 9μm and a minimum laser via hole size of 55μm. Our company uses industry-leading packaging substrate materials, with most of them sourced from Japan, such as Mitsubishi’s BT series (e.g., L-832NX, HL832NX), Showa Denko materials (e.g., MCL-E705G, MCL-E-770G, MCL-E-700G, MCL-E-795G), and Ajinomoto materials (e.g., GX92R, GXT31R2, GZ41R2H, GL102R8HF, GL103R8H). Additionally, we produce high-precision HDI PCBs with trace/spacing as small as 15μm. We also offer glass-core FCBGA substrates ranging from 4 layers to 20 layers, which deliver superior flatness. Furthermore, we have a wide variety of materials not listed here, and we welcome you to share your specific requirements so we can customize production accordingly.

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Our Services

Package substrate

Packaging Substrate Manufacturer

We produce BGA substrates, FCBGA substrates, Glass substrates,FCCSP substrates and other types package substrates with ultra-small trace and pitch, we have various types of materials, the substrates will be produced in a factory of 20,000 employees, So,the quality is perfect, the delivery time is fast, the price is reasonable.

china ic substrates

SIP Package

SIP Package, which encompasses various advanced packaging technologies such as Wire Bonding & Die Stack, Flip Chip, Embedded, Package on Package, Multi-chip Module, Package in Package, and other innovative solutions, offers a range of options for optimizing performance and space utilization in electronic devices.

Package Substrates Design

Package Substrates Design

When you design the package substrate, if you have any design questions, such as: standard laser via hole diameter(4mil), the minimum via hole diameter(2.2mil), and the minimum marks, spacing, solder resistance design, material selection, etc., or production process capability details, you can contact us at any time, it is our pleasure to help you.

How to initiate the order process for Package Substrate and Microtrace PCB manufacturing and SIP Package

① Needs Analysis

Conduct a thorough analysis of customer requirements and technical specifications in initial communications to accurately capture the customized Package Substrate/HDI PCB requirements.

② SEND GERBER FILES

Please send your Package Substrate gerber files or PCB gerber files, Each BGA Substrate/PCB are individually customized, so we have to confirm all the details, whether it can meet customer requirements, we will strictly according to customer requirements production. after checking, if not big problem, we will send price and lead time back to you.

③ PO,Payment and EQ list

After you agree the price and lead time, please send a PO list at first, then, help to do the payment, Our engineers will confirm all the details again, and the EQ confirmation document will be sent to you. All the questions have been confirmed clearly, and the production has been carried out according to the customer’s requirements.

④ Working Gerber Checking and

After we finsihed all EQ(design detail) list checking, our engineer will make the working gerber files, if you need, the working gerber files will be sent to you, your engineer need to compare it , if no other questions, you need to approve to produce the Packaging Substrates or HDI PCBs.

⑤ 100% Electric Test

When we finished the Package Substrates or HDI PCBs, All the substrates and pcb boards will be 100% passed the electric test, So, There won’t be any open circuit, short circuit problems.

⑥ Air Transportation

We mainly use the official DHL, Fedex air freight to send goods to customers, fast, efficient and safe. If the customer has other shipping requirements, we will send the goods to the designated place according to the customer’s requirements.

We specialize in Glass, Ceramic, BT packaging substrates, high-frequency/high-speed substrates, wire bonding substrates, and ultra-small trace HDI circuit boards. With over 100 expert engineers, we’re here to assist with your design or production inquiries—free of charge! Contact us at PCB@ALCANTAPCB.COM.

PCB production

Packaging substrate production capacity

  • Layer count: 2-26
  • Finished copper thickness: 10um to 21um
  • Minimum line/track width: 9um
  • Minimum line/track spacing: 9um
  • Finished board thickness range: 0.1-3.0mm
  • Minimum drill hole size (laster): 55um
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PCB Assembly

  • ISO 9001:2015 certified
  • Traceability through BGA substrates two-dimensional laser marking
  • RoHS and lead-free assembly
  • Component outsourcing or turnkey projects
  • Various IC packages including BGA, CGA, QFN, DFN, CSP

Special materials

  • Glass Substrate materials
  • High-frequency materials
  • Metal Substrate materials
  • ABF Substrate materials
  • Showa Denko materials
  • Ceramic substrate materials
  • BT Substrate materials
  • PTFE (Polytetrafluoroethylene)
  • Rogers materials
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PCB production
PCB production

ALCANTA TECHNOLOGY (SHENZHEN) CO., LTD

Specializes in research, development, production, and sales of a wide range of PCB types across various industries. Our offerings include HDI, multilayer, rigid-flex, heavy copper, metal-based, high-frequency, and flex boards. These products serve industrial control, medical electronics, automotive electronics, telecommunications, LED lighting, and other sectors. With a focus on innovation and expanding product applications, we excel in the low-volume market segment. Our capabilities include customized PCB production tailored to customer specifications, leveraging Advanced MSAP and SAP technologies. We specialize in FC BGA Packaging Substrates ranging from 4 to 16 layers, achieving industry-leading smallest gap and trace dimensions of 9um/9um, utilizing ABF base materials.

Customers & Partners

 

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Total Quality Certification System

Our factory has implemented lean improvements in areas like DFM, NPI, IQC, IPQC, and OQA. These efforts have helped us achieve certifications including ISO 9001:2015, ISO 13485, IATF 16949, and SGS. Our dedication to quality and service has built long-term relationships with medium and large customers.

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