ABF substrate, short for Ajinomoto Build-up Film substrate, is a critical component in semiconductor packaging. It serves as a foundation for mounting and connecting semiconductor chips within electronic devices. ABF substrates consist of multiple layers of insulating material with embedded conductive traces, providing pathways for electrical signals to travel between components.
The significance of ABF substrate lies in its ability to support miniaturization and enhance the performance of electronic devices. Its high-density interconnection capability enables efficient signal transmission, contributing to faster processing speeds and improved overall functionality. As semiconductor technology continues to advance, the demand for ABF substrates grows, making them indispensable in the development of cutting-edge electronic products.
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