Exploring Advanced Flip Chip Packaging Technology
In recent decades, flip chip packaging technology has e […]
Henry is a PCB engineer with more than 20 years of industry experience and is proficient in circuit design and printed circuit board (PCB) manufacturing. With his extensive expertise and skills, he is committed to providing customers with high-quality customized solutions for their PCB needs. Whether it is a simple circuit design or complex multi-layer board manufacturing, Henry can tailor a solution to meet specific requirements. With his expertise and outstanding technical abilities, clients can entrust their projects to him with confidence, ensuring that their creative and product visions are optimally realized. If you have any questions or need help with PCBs, Henry can share his wealth of knowledge and experience. Please feel free to contact us for professional guidance on all PCB matters.
In recent decades, flip chip packaging technology has e […]
Welcome to our blog, where we delve into the dynamic re […]
Flip Chip Package Substrate (FCPS) plays a pivotal role […]
Package substrate technology plays a pivotal role in th […]
In the realm of PCB fabrication, substrate material pla […]
PCB substrates serve as the foundational material upon […]
Printed Circuit Boards (PCBs) serve as fundamental comp […]
Semiconductor substrates serve as the foundation of mod […]
Packaging substrate manufacturers play a pivotal role i […]
QFN (Quad Flat No-Lead) packages are a popular choice i […]
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