Navigating Flip Chip BGA Substrate Selection
In the realm of electronic packaging, Flip Chip BGA Sub […]
Henry is a PCB engineer with more than 20 years of industry experience and is proficient in circuit design and printed circuit board (PCB) manufacturing. With his extensive expertise and skills, he is committed to providing customers with high-quality customized solutions for their PCB needs. Whether it is a simple circuit design or complex multi-layer board manufacturing, Henry can tailor a solution to meet specific requirements. With his expertise and outstanding technical abilities, clients can entrust their projects to him with confidence, ensuring that their creative and product visions are optimally realized. If you have any questions or need help with PCBs, Henry can share his wealth of knowledge and experience. Please feel free to contact us for professional guidance on all PCB matters.
In the realm of electronic packaging, Flip Chip BGA Sub […]
Navigating the realm of PCB material comparison is cruc […]
In recent years, COB LED (Chip on Board) technology has […]
Over the years, the landscape of integrated circuit (IC […]
A COB LED, or Chip on Board LED, revolutionizes lightin […]
FR4, standing for Flame Retardant 4, is a widely used m […]
Ball Grid Array (BGA) substrates serve as critical comp […]
Flip chip technology represents a pivotal advancement i […]
Etch back, a pivotal process in semiconductor manufactu […]
In the intricate world of electronic packaging, Ball Gr […]
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