Experienced PCB Manufacturing and Assembly Services

ALCANTAPCB, specialized in printed circuit board manufacturing and PCB assembly for morethan 20 years, We specialize in custom design and production of high-complexity multilayerPCBs, encompassing substrate packaging, comprehensive PCB testing, final packaging, globalshipping, and more. Our commitment is to provide top-notch solutions tailored to meet yourspecific needs

alcanta pcb

Our Services

PCB ASSEMBLY

We specialize in manufacturing printed circuit boards (PCBs) and offer a comprehensive range of services, from rapid prototypes to high-volume production, including assembly (PCBA), for customers worldwide.

PCB DESIGN

We provide rapid PCB prototype manufacturing services and welcome special orders involving premium layering and unconventional materials. Competitive pricing and excellent quality ensure significant benefits for our customers.

PCB DESIGN

We offer turnkey PCB services, covering everything from design to assembly and final testing. Our extensive design tools and manufacturing process expertise enhance customer design efficiency.

How to initiate the order process for PCB manufacturing and assembly services

Needs Analysis

Conduct a thorough analysis of customer requirements and technical specifications in initial communications to accurately capture the customized PCB requirements.

Design Proposal

Provide a personalized PCB design proposal, including circuit layout, layer structure, and other key parameters. Emphasize close collaboration with the customer to ensure the design aligns with their expectations and technical requirements.

Technical Discussions and Confirmation

Engage in in-depth discussions with the customer about the design proposal, explain technical details, and ensure a clear understanding of the PCB design and technical features, reaching consensus.

Material Selection and Procurement

With customer approval, select high-quality materials that meet design requirements and proceed with procurement. Ensure selected materials comply with industry standards and customer expectations.

Production and Quality Inspection

Transform the design into actual PCB products, following rigorous production and quality inspection processes to ensure each PCB meets design specifications and quality standards. Customers may participate in inspections or audits at this stage.

Delivery and After-Sales Support

Timely deliver the customized PCB products to the customer and provide after-sales support. Ensure any issues during usage are promptly addressed, fostering the establishment of a long-term collaborative relationship.

What do our PCB products include?

Our dedicated team customizes components at every stage, ensuring flexibility and meeting specific needs. For design inquiries, contact us for free assistance.

PCB production

PCB production

  • Layer count: 1-50
  • Finished copper thickness: 0.5-12 OZ
  • Minimum line/track width: 2.5 mil
  • Minimum line/track spacing: 250 microns
  • Finished board thickness range: 0.1-10mm
  • Minimum drill hole size (mechanical): 0.15mm
PCB-Assembly-2

PCB Assembly

  • ISO 9001:2015 certified
  • Traceability through PCB two-dimensional laser marking
  • RoHS and lead-free assembly
  • Component outsourcing or turnkey projects
  • Various IC packages including BGA, CGA, QFN, DFN, CSP

Special materials

  • FR-4
  • High-frequency materials
  • Metal substrate
  • Flexible PCB materials
  • Ceramic substrate
  • Polyimide (PI)
  • PTFE (Polytetrafluoroethylene)
  • Rogers board

ALCANTA TECHNOLOGY (SHENZHEN) CO., LTD

Specializes in research, development, production, and sales of a wide range of PCB types across various industries. Our offerings include HDI, multilayer, rigid-flex, heavy copper, metal-based, high-frequency, and flex boards. These products serve industrial control, medical electronics, automotive electronics, telecommunications, LED lighting, and other sectors. With a focus on innovation and expanding product applications, we excel in the low-volume market segment. Our capabilities include customized PCB production tailored to customer specifications, leveraging Advanced MSAP and SAP technologies. We specialize in FC BGA Packaging Substrates ranging from 4 to 16 layers, achieving industry-leading smallest gap and trace dimensions of 9um/9um, utilizing ABF base materials.

Customers & Partners

 

The latest printed circuit board manufacturing technologies, PCB design advice, PCB assembly issues and electronics industry news.

intel glass substrates

Role of Intel Glass Substrates in Next-Gen Packaging

Intel glass substrates represent a groundbreaking innovation in semiconductor packaging technology, playing a pivotal role in the development of next-generation processors. Traditional organic substrates have long been used for chip packaging,…
fr4 substrate full form

Key Properties of the FR4 Substrate Full Form and Its Significance

FR4 is one of the most widely used materials in the printed circuit board (PCB) industry due to its excellent properties and versatility. Commonly recognized for its reliability, FR4 serves as the backbone of many electronic devices, providing…
fr4 epoxy substrate

Understanding the Key Properties of FR4 Epoxy Substrate in PCBs

FR4 material is widely used in the electronics industry for its cost-effectiveness, mechanical strength, and excellent electrical insulating properties. It is a composite of epoxy resin and woven glass fiber, offering durability and thermal…
dielectric constant of fr4 substrate

Understanding the Dielectric Constant of FR4 Substrate in PCB

FR4 is one of the most widely used materials in printed circuit board (PCB) manufacturing due to its excellent mechanical strength, cost-effectiveness, and electrical insulation properties. It is a composite material consisting of woven glass…
coreless substrate technology

The Role of Coreless Substrate Technology in Modern Electronics

Coreless substrate technology represents a significant advancement in the field of electronic packaging. Unlike traditional substrates that rely on a central core, coreless substrates eliminate this component, offering a thinner, more compact…
coreless substrate process flow

Understanding the Coreless Substrate Process Flow in Electronics

Substrates play a crucial role in packaging for electronic applications, providing a foundation for the assembly of various components like integrated circuits (ICs) and other microelectronic devices. These materials are essential for ensuring…
fr4 pcb rogers pcb aluminum pcb

Differences Between FR4 PCB, Rogers PCB, and Aluminum PCB

In the world of electronics, PCB materials play a crucial role in determining the performance, durability, and cost-effectiveness of electronic devices. Printed Circuit Boards (PCBs) are the backbone of nearly all modern electronics, connecting…
ceramic vs organic substrate

Key Differences in Ceramic vs Organic Substrate for Electronics

In PCB (Printed Circuit Board) manufacturing, the choice of substrate material is crucial as it directly affects the performance and application of the circuit board. Substrate materials determine the mechanical strength, electrical performance,…
arlon substrate

Key Features of Arlon Substrate for High-Performance PCBs

Arlon is a renowned brand in the electronics industry, recognized for its high-performance substrates used in a wide range of applications. With decades of expertise, Arlon has established itself as a leader in the development of advanced materials…

Total Quality Certification System

Our factory has implemented lean improvements in areas like DFM, NPI, IQC, IPQC, and OQA. These efforts have helped us achieve certifications including ISO 9001:2015, ISO 13485, IATF 16949, and SGS. Our dedication to quality and service has built long-term relationships with medium and large customers.

ALCANTA quality certification system
chip packaging-2

Contact Us